Dine & Learn at CU Boulder: Package and PCB Materials by Darren Hitchcock (Panasonic)

Name: Dine & Learn at CU Boulder: Package and PCB Materials by Darren Hitchcock (Panasonic)
Start: 2026-11-05T19:00:00
End: 2026-11-05T20:30:00
Location: Room: ECCR 200, Bldg: Engineering Center

Starts: November 5, 2026 at 7:00 PM
Ends: November 5, 2026 at 8:30 PM
Format: In person
Location: Room: ECCR 200, Bldg: Engineering Center, Boulder, CO, United States

About This Event

Abstract: TBD Parking: Parking information at CU Boulder will be provided to event registrants closer to the event date. ** The Front Range Speaker Series brings together students, faculty, IEEE members, and engineering professionals for technical talks from experts across industry and academia. This event is part of the ongoing speaker series co-hosted by the IEEE University of Colorado Boulder Student Branch and the IEEE Denver Section. This series is open to all levels from technical beginners to experts. Upcoming Talks: - Thursday, November 5, 2026:"Package and PCB Materials" by Darren Hitchcock (Panasonic) - Thursday, December 3, 2026: Student presentations showcasing research and industry topics