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Dine & Learn at CU Boulder: Package and PCB Materials by Darren Hitchcock (Panasonic)

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Online
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VIRTUAL, Denver, Colorado, United States

About This Event

Dine & Learn at CU Boulder: Package and PCB Materials by Darren Hitchcock (Panasonic) Abstract: Printed circuit boards are often viewed simply as the platform that connects electronic components, but as systems become faster and more complex, the PCB itself becomes a critical part of the electrical design. This talk will begin with the basics of PCB construction and manufacturing, using familiar two-layer boards to introduce copper, laminates, drilling, plating, and etching. From there, it will build toward the multilayer boards used in modern computers and high-performance servers, where layer count, vias, materials, and fabrication become much more challenging. The discussion will explore how higher data rates increase dielectric and conductor loss, driving the need for lower-loss laminates, smoother copper, more advanced via structures, and tighter manufacturing controls. Along the way, attendees will see why a 30-layer server board is far more than a simple extension of a basic PCB. The goal is to give attendees a practical understanding of how electrical performance, manufacturability, reliability, and cost come together in modern PCB design. Parking: Parking information at CU Boulder will be provided to event registrants closer to the event date. ** The Front Range Speaker Series brings together students, faculty, IEEE members, and engineering professionals for technical talks from experts across industry and academia. This event is part of the ongoing speaker series co-hosted by the IEEE University of Colorado Boulder Student Branch and the IEEE Denver Section. This series is open to all levels from technical beginners to experts. Upcoming Events: - Thursday, December 3, 2026: Student presentations showcasing research and industry topics - More Coming in the Spring! Agenda: Event Agenda - 6:45–7:00 PM — Networking, arrival, and attendee check-in - 7:00–7:10 PM — Welcome and speaker introduction - 7:10–8:10 PM — Speaker presentation - 8:10–8:20 PM — Q&A and discussion - 8:20–8:30 PM — Closing remarks and upcoming speaker-series announcements Room: ECCR 200, Bldg: Engineering Center, 1111 Engineering Drive, Boulder, Colorado, United States, 80309